Semiconductor report forecasts glass substrate growth

SEMI and Global Net Corp. have published a report on the glass core substrate market and development trends in semiconductors, projecting rapid growth for the technology from 2028 to 2040.

The study examines glass core substrates as chipmakers explore new packaging approaches for artificial intelligence and high-performance computing workloads, which are driving demand for larger semiconductor packages and finer interconnects. Its market scenarios suggest initial production could begin around 2028 in selected high-performance applications, before broader adoption in more complex package designs.

Based on the average of its positive, base, and negative scenarios, the report forecasts a compound annual growth rate of 67.2% between 2028 and 2040. It also tracks industry activity across Asia, North America, and Europe, where companies and research groups are working on materials, processing, inspection, and other parts of the supply chain.

Packaging shift

The assessment places glass core substrates within the semiconductor industry's broader shift toward advanced packaging as gains from traditional device scaling become harder to achieve. As computing demands rise, manufacturers are evaluating packaging methods that can support larger formats and denser interconnects.

Glass core substrates are one option under consideration for high-end semiconductor packages because of their dimensional stability and suitability for larger package sizes. Commercial progress will depend on how the industry addresses barriers to wider adoption, including work needed across manufacturing and supply networks.

The study also outlines expected application areas, including AI, HPC, advanced processors, co-packaged optics, and image sensors. It reviews company activity across substrate supply, glass materials, equipment, and process technologies, alongside development hubs and industry consortia.

SEMI, an industry association focused on the semiconductor and electronics supply chain, produced the research with Tokyo-based Global Net Corp. Global Net provides wafer processing, equipment sales, consulting, technical seminars, research groups, and publishing services for the semiconductor and electronics sectors.

Clark Tseng, Senior Director of Market Intelligence at SEMI, commented on the backdrop to the report. "As chipmakers look for new ways to improve system performance beyond traditional device scaling, advanced packaging has become a critical area of innovation," said Clark Tseng, Senior Director of Market Intelligence at SEMI.

He added: "Glass core substrates are being evaluated as one possible solution for future high-end packages because they may help support larger package sizes, finer interconnects, and improved dimensional stability compared with conventional package-substrate materials. This new report helps industry stakeholders understand where glass core substrates may fit in the next phase of packaging technology and what challenges must be addressed to achieve broader adoption."

Regional activity

The report describes a development landscape that is no longer confined to a single geography. Activity spans established semiconductor centers in Asia, North America, and Europe, reflecting broader interest in packaging technologies that could support the next generation of AI and computing hardware.

That regional spread matters because packaging innovation depends on a broad range of suppliers, not just chip designers. Progress in glass core substrates will require coordination among materials specialists, equipment makers, inspection providers, substrate manufacturers, and research institutions.

The study stops short of presenting commercial adoption as assured. Instead, it frames the market in scenarios, indicating that the pace of adoption will depend on technical and manufacturing progress, as well as the needs of end applications requiring increasingly large and complex package architectures.

For the semiconductor sector, the report adds to a growing body of market analysis on how advanced packaging may shape competition as AI systems demand greater computing density and new ways of linking chips. In that context, the projected 67.2% compound annual growth rate suggests that, if early production begins as outlined, glass core substrates could become a closely watched segment of the packaging market through 2040.